福莱新材发布第三代电子皮肤产品 植入芯片算法打造触觉智能TPU

Core Viewpoint - The company has officially launched its third-generation electronic skin product, marking a strategic shift from a functional coating material supplier to an intelligent sensing solution provider, driven by advancements in AI technology [1][2]. Group 1: Product Development - The third-generation electronic skin features three core breakthroughs: integration of sensing and processing through embedded chips, advanced intelligent algorithms for enhanced perception, and a significantly increased effective sensing area [2][3]. - The product is described as a comprehensive system combining flexible materials, chips, algorithms, and large models, representing a significant upgrade from traditional single-function materials [2]. Group 2: Research and Development - The company's R&D team has doubled in size compared to the end of last year, attracting experts in sensor technology and AI algorithms, which enhances its competitive edge in the industry [3]. - The company emphasizes continuous investment in R&D, focusing on tactile sensors for robotics, industrial detection systems, and consumer electronics to deepen its technological moat [2][3]. Group 3: Market Expansion - The company is actively expanding into the North American market, establishing a wholly-owned subsidiary in California to support business and technical operations, positioning itself as a key supplier of electronic skin products [4]. - The company has received significant interest from leading humanoid robot companies in North America, with several clients placing bulk orders exceeding one hundred units [4]. Group 4: Strategic Focus - The company aims to explore new profit growth points by focusing on flexible tactile sensors, electronic-grade functional materials, and environmentally friendly coating packaging materials [5]. - The company's heat transfer film business is experiencing rapid growth, with applications expanding from clothing to personalized consumer products, particularly in overseas markets [5].