纳芯微今起招股 计划全球发售1906.84万股H股

Group 1 - The company plans to conduct an IPO from November 28 to December 3, aiming to globally issue 19.0684 million H-shares, with 10% allocated for public offering in Hong Kong and 90% for international offering, including a 15% over-allotment option [1] - The maximum offer price is set at HKD 116.00 per share, with expected trading on the Hong Kong Stock Exchange starting December 8, 2025 [1] - The company has secured cornerstone investors, committing approximately HKD 1.0891 billion for the shares [1] Group 2 - Assuming the offer price of HKD 116.00 per share and no exercise of the over-allotment option, the net proceeds from the global offering are estimated to be around HKD 2.0964 billion [1] - The allocation of the proceeds includes approximately 18% for enhancing underlying technology capabilities and process platforms, 22% for expanding the product portfolio with a focus on automotive electronics, 25% for expanding the overseas sales network and promotion, 25% for strategic investments and/or acquisitions, and 10% for working capital and general corporate purposes [1] Group 3 - The company operates on a fabless model, focusing on chip research and design while outsourcing wafer manufacturing and most packaging testing [2] - According to Frost & Sullivan, the company ranks 14th in the Chinese analog chip market with a market share of 0.9% based on projected 2024 analog chip revenue, and it ranks 5th among Chinese analog chip companies [2]