通富微电(002156.SZ)：拟注册发行银行间债券市场非金融企业债务融资工具

Core Viewpoint - Tongfu Microelectronics Co., Ltd. plans to issue non-financial corporate debt financing instruments in the interbank bond market, with a total amount not exceeding RMB 3 billion to optimize its debt structure and broaden financing channels [1] Group 1 - The company convened the 15th meeting of the 8th Board of Directors on November 28, 2025, to review the proposal for the issuance of debt financing tools [1] - The planned issuance includes short-term financing bonds and medium-term notes, with the specific registration scale subject to approval by the trading association [1] - The initiative aims to meet the operational development needs of the company [1]