澜起科技：根据行业报告，DDR6内存模组有望在2029年前后实现商业化

Core Viewpoint - The ongoing discussions by JEDEC regarding DDR6 standards may lead to an expansion in the memory interconnect chip market due to the anticipated increase in transmission speeds and complexity of DDR6 memory modules [1] Group 1: Company Insights - 澜起科技 indicates that DDR6 memory modules are expected to require more complex memory interconnect chips, which could drive market growth [1] - The commercialization of DDR6 memory modules is projected to occur around 2029, according to industry consultants [1] Group 2: Industry Trends - The discussions on DDR6 standards by JEDEC highlight a significant evolution in memory technology, suggesting a trend towards higher performance and more sophisticated memory solutions [1] - The anticipated increase in the memory interconnect chip market size reflects the broader industry shift towards advanced memory technologies [1]