迈为股份：公司高选择比刻蚀设备及混合键合设备等可用于DRAM(高带宽存储器HBM)工艺

Core Viewpoint - The company, Maiwei Co., has indicated that its high selectivity etching equipment and hybrid bonding equipment can be utilized in the DRAM (High Bandwidth Memory, HBM) process [1] Group 1 - The company's etching and thin film deposition equipment are widely used in the manufacturing of storage chips and logic chips [1]