3 6 Ke·2025-12-01 01:43Core Insights - North American cloud service providers (CSPs) like Google and Meta are actively engaging with Intel regarding the EMIB solution, indicating a shift in the chip landscape with the introduction of Google's TPU v9 by 2027 [1] - EMIB, a 2.5D advanced packaging technology from Intel, is gaining attention as CSPs face challenges with TSMC's CoWoS due to capacity shortages and high costs [1][2] - The rise of ASIC solutions, particularly represented by Google's TPU, is driving the demand for EMIB technology, with expectations of explosive growth in ASIC numbers from major players by 2026-2027 [2] Group 1: EMIB Technology and Market Dynamics - EMIB is positioned as a competitive alternative to TSMC's CoWoS, primarily due to its advantages in area and cost [3] - CoWoS has a high level of technical maturity but faces significant capacity constraints, with NVIDIA alone accounting for over 60% of its production [3] - EMIB allows for highly customizable packaging layouts, which may make it the preferred choice for ASIC applications [3][4] Group 2: Cost and Performance Considerations - EMIB's design simplifies the structure by eliminating expensive intermediary layers, providing a cost-effective solution for AI clients [4] - Despite its advantages, EMIB is currently limited by its interconnect bandwidth and signal transmission distance, making it more suitable for ASIC customers [5]