美光科技(MU.US)豪掷96亿美元在日本建厂 分散产能并竞逐HBM市场
Micron TechnologyMicron Technology(US:MU) 智通财经网·2025-12-01 06:40

Group 1 - Micron Technology plans to invest 1.5 trillion yen (approximately 96 billion USD) to build a new factory in Hiroshima, Japan, for the production of advanced high-bandwidth memory chips [1] - The construction is expected to begin in May next year, with production anticipated to start around 2028 [1] - The Japanese Ministry of Economy, Trade and Industry will provide subsidies of up to 500 billion yen for this project [1] Group 2 - The Japanese government views artificial intelligence as a key technology to address national security, economic stagnation, and demographic challenges, and is actively investing in and supporting the semiconductor industry [1] - Japan is providing substantial subsidies to attract foreign chip manufacturers like Micron and TSMC to invest in its semiconductor sector [1] - TSMC has already established its first wafer factory in Kumamoto, Japan, which has begun mass production, with plans for a second factory expected to start production by the end of 2027 [1] Group 3 - Rapidus announced plans to start construction of a next-generation 1.4nm wafer factory in the fiscal year 2027, with production expected to begin in Hokkaido by 2029 [2] - The demand for high-bandwidth memory chips is driven by advancements in artificial intelligence and investments in data centers [2] - Expanding the factory in Hiroshima will help Micron diversify its production layout away from Taiwan and compete with market leader SK Hynix [2]

美光科技(MU.US)豪掷96亿美元在日本建厂 分散产能并竞逐HBM市场 - Reportify