USC(SH:688403) Xin Lang Cai Jing·2025-12-01 07:26Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is actively expanding its business in the semiconductor industry, particularly in advanced packaging and testing services for integrated circuits, with a focus on storage chips and OLED technology. Group 1: Company Developments - On October 14, 2025, the company announced a strategic investment in Hefei Xinfeng Technology Co., Ltd., acquiring a 27.5445% stake and forming a partnership to develop 3D DRAM and other storage chip packaging services to meet the growing demand in the AI infrastructure era [2]. - The company is focusing on advanced packaging technologies, including Chiplet, Fan-out, 3D, and SiP, leveraging its expertise in bump manufacturing as a foundational technology [2][3]. - As of September 30, 2025, the company reported a revenue of 1.295 billion yuan, a year-on-year increase of 21.05%, and a net profit of 124 million yuan, up 23.21% from the previous year [9]. Group 2: Financial Performance - The company's overseas revenue accounted for 54.15% of total revenue, benefiting from the depreciation of the Chinese yuan [4]. - The company has distributed a total of 161 million yuan in dividends since its A-share listing [9]. - As of September 30, 2025, the number of shareholders increased by 15.93%, with an average of 36,445 shares held per shareholder, reflecting growing investor interest [9]. Group 3: Market Position - Hefei Xinhui Microelectronics specializes in high-end packaging and testing services for integrated circuits, with its main products being integrated circuit packaging and testing [3][8]. - The company operates within the semiconductor industry, specifically in the integrated circuit packaging and testing sector, and is involved in various concept sectors including packaging, automotive electronics, and chip technology [8].