USC(SH:688403) Xin Lang Cai Jing·2025-12-02 07:44Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is strategically expanding its business in the semiconductor industry, particularly in advanced packaging and testing services for integrated circuits, to capitalize on the growing demand for storage chips in the AI infrastructure era [2][3]. Group 1: Company Developments - On October 14, 2025, the company announced a significant investment by acquiring a 27.5445% stake in Hefei Xinfeng Technology Co., Ltd., and forming a strategic partnership with East China Technology (Suzhou) Co., Ltd. to expand into 3D DRAM and other storage chip packaging services [2]. - The company is focusing on advanced packaging technologies, including Chiplet, Fan-out, 3D, and SiP, leveraging its expertise in bump manufacturing as a foundational technology [2]. - As of September 30, 2025, the company reported a revenue of 1.295 billion yuan, representing a year-on-year growth of 21.05%, and a net profit of 124 million yuan, with a growth of 23.21% [9]. Group 2: Financial Performance - The company's overseas revenue accounted for 54.15% of total revenue, benefiting from the depreciation of the Chinese yuan [4]. - The company has distributed a total of 161 million yuan in dividends since its A-share listing [9]. - As of September 30, 2025, the number of shareholders increased to 23,500, with an average of 36,445 shares held per shareholder, indicating growing investor interest [9]. Group 3: Market Position - Hefei Xinhui Microelectronics specializes in high-end packaging and testing services for integrated circuits, with its main products being integrated circuit packaging and testing [3]. - The company operates within the semiconductor industry, specifically in the integrated circuit packaging and testing sector, and is involved in various concept sectors including packaging, automotive electronics, and chip technology [8].