威海银行完成发行2025年科技创新债券
WEIHAI BANKWEIHAI BANK(HK:09677) Zhi Tong Cai Jing·2025-12-02 10:01

Group 1 - The company, Weihai Bank, has successfully issued a technology innovation bond in the national interbank bond market [1] - The total issuance scale of the bond is RMB 1 billion, with a coupon rate of 1.94% [1] - The bond includes a conditional redemption right for the issuer at the end of the fifth year [1]