美光科技取得在接合堆叠微电子组件时的温度改变及相关衬底和组合件专利

Group 1 - Micron Technology has been granted a patent titled "Temperature Change and Related Substrates and Assemblies When Joining Stacked Microelectronic Components" [1] - The patent authorization announcement number is CN 113410147 B, with an application date of March 2021 [1]