兴森科技：公司FCBGA封装基板项目样品持续交付认证中

Group 1 - The core viewpoint of the article is that the company, Xingsen Technology, is actively progressing in the certification of its FCBGA packaging substrate project, with a steady increase in sample deliveries [2] - As of now, the feedback from the testing results of the FCBGA packaging substrates indicates that no abnormalities have been found in the substrates [2]