中天精装：ABF载板产品可以用于TPU芯片封装

Core Viewpoint - Zhongtian Jingzhuang (002989) announced that its affiliated company, Keri Semiconductor Technology (Dongyang) Co., Ltd., produces ABF substrate products that can be used for TPU chip packaging [1] Group 1 - Zhongtian Jingzhuang responded to investor inquiries on an interactive platform [1] - The main business of Keri Semiconductor Technology involves ABF substrate products [1] - ABF substrates are applicable in the packaging of TPU chips [1]