通富微电：封装测试所需主要原材料为引线框架、基板、键合丝和塑封料等

Core Viewpoint - Tongfu Microelectronics has stable supply channels for its main raw materials required for packaging and testing, including lead frames, substrates, bonding wires, and encapsulation materials [2] Group 1 - The company sources its main raw materials both domestically and internationally [2] - The company is attentive to policies and industry trends regarding self-sufficiency, domestic substitution, and localization of equipment and materials [2] - The company aims to seize opportunities from these trends to create value for its shareholders [2]