兴森科技：公司IC封装基板为芯片封装原材料

Core Insights - The company, Xingsen Technology, has confirmed that its IC packaging substrates are essential raw materials for chip packaging, utilized in various applications including CPU, GPU, FPGA, ASIC, storage chips, and RF chips [2] Group 1 - The IC packaging substrates are specifically designed for chip packaging applications [2] - The specific application scenarios for chip products are determined by customers based on their individual needs [2]