Piotech (SH:688072) Ju Chao Zi Xun·2025-12-06 01:18Core Viewpoint - The investment by拓荆科技 in芯丰精密 aims to strengthen the company's strategic layout and industrial synergy in the 3D integration and advanced packaging sectors [1][3]. Investment Details -拓荆科技 plans to acquire a stake in芯丰精密 for no more than RMB 270 million, which represents 16.4154% of the company's registered capital post-financing [1]. - The associated party,丰泉创投, will invest RMB 30 million for a 1.8239% stake [1]. - The total registered capital of芯丰精密 will increase from RMB 57,891,044 to RMB 60,819,616 after the financing round [3]. Company Profile -芯丰精密 specializes in the research and manufacturing of core equipment and materials for 3D integration and advanced packaging [3]. - The company has developed capabilities in core software and components, with a product line that includes thinning, dicing, and slicing equipment, as well as advanced bonding equipment [3]. -芯丰精密's products have been successfully applied in advanced storage and image sensor fields [3]. Strategic Importance - The investment is seen as a strategic move to enhance the technological synergy in the high-tech semiconductor equipment market [4]. - As the semiconductor industry evolves towards 3D integration and advanced packaging, the demand for core equipment is increasing, highlighting the strategic value of such investments [4].