Group 1 - Guangdong Tianyu Semiconductor Co., Ltd. officially listed on the Hong Kong Stock Exchange on December 5, 2023, with a global offering of 30.0705 million shares at an issue price of HKD 58 per share, raising approximately HKD 1.744 billion [1] - Founded in 2009 and headquartered in Dongguan, China, Tianyu Semiconductor is one of the earliest companies focused on the research and manufacturing of silicon carbide (SiC) epitaxial wafers, with products used in electric vehicles, photovoltaics, energy storage, and rail transportation [1] - The company currently operates a production base of approximately 35,978 square meters in Dongguan, primarily for 6-inch SiC epitaxial wafers, with a new base expected to be operational by the end of 2025 to further enhance production capacity [1] Group 2 - The funds raised from the IPO will primarily be used for expanding overall production capacity over the next five years, including the expansion of 8-inch SiC epitaxial wafers and establishing a production base in Southeast Asia [3] - The company aims to leverage its successful experience in third-generation semiconductor materials to extend its research focus to gallium oxide and other fourth-generation semiconductor developments, with a key investment of 700 million yuan in the industrialization of bonded substrate epitaxy technology [3] Group 3 - Before the IPO, the founders Li Xiguang and Ouyang Zhong controlled approximately 29.05% and 18.21% of the company, respectively, while Huawei Hubble Technology held about 6.57% and BYD held 1.50% [1]
天域半导体在香港挂牌上市，东莞生态园新基地预计年底投产