台积电先进封装订单大爆满 扩大委外释单 日月光大赢家

Core Viewpoint - TSMC's advanced packaging capacity is fully booked, leading to significant outsourcing opportunities, benefiting companies like ASE Technology Holding and Siliconware Precision Industries [1][2] Group 1: TSMC's Outsourcing and Market Impact - TSMC is experiencing strong demand for its advanced packaging services, particularly in CoWoS and CoWoP technologies, which are critical for high-performance computing [1] - The company has fully booked its advanced process capacities, including 2nm and 3nm technologies, prompting it to accelerate outsourcing of advanced packaging and testing to meet AI customer demands [1] Group 2: ASE Technology Holding and Siliconware Precision Industries - ASE Technology Holding and Siliconware Precision Industries have invested over NT$11.17 billion in the past two months to expand production and acquire equipment in response to TSMC's outsourcing orders [1][2] - ASE Technology Holding anticipates strong performance in its advanced packaging and testing business, projecting annual revenue of $1.6 billion for this year, with expectations to increase by over $1 billion by 2026, reflecting a growth rate of over 60% [2] Group 3: Industry Trends and Future Outlook - The demand for high-performance computing driven by generative AI is expected to remain strong, with major companies like NVIDIA, AMD, Microsoft, Meta, Amazon AWS, and Google competing for capacity [1] - ASE Technology Holding's new facilities, including the Dulin and Douliu plants, are expected to be operational by next year, further solidifying its position in the semiconductor packaging market [2]