IPO研究｜2024年中国环氧塑封料行业市场规模60.2亿元

Group 1 - Jiangsu Zhongke Kehua New Materials Co., Ltd. (Zhongke Kehua) has received acceptance for its IPO on the Sci-Tech Innovation Board, with China Merchants Securities as the sponsor [3] - Established in October 2011, Zhongke Kehua focuses on the R&D, production, and sales of semiconductor packaging materials, primarily epoxy molding compounds [3] - The company has become one of the few domestic manufacturers capable of independent R&D and large-scale production of mid-to-high-end epoxy molding compounds, ranking fourth in 2022 and third in 2023 among domestic manufacturers, with a projected rise to second place in 2024 [3] Group 2 - The epoxy molding compound industry is a critical support sector within the semiconductor supply chain, with its development trends aligning with the overall semiconductor and semiconductor materials industries [4] - From 2015 to 2021, the market size of China's epoxy molding compounds grew from 4.37 billion to 7.52 billion yuan, with a compound annual growth rate of 9.5% [4] - The market experienced a decline in 2022 and 2023 due to reduced end demand in the semiconductor industry, but is expected to rebound in 2024, with a projected market size of approximately 6.02 billion yuan, reflecting a 2.0% year-on-year growth [4] Group 3 - Mid-to-high-end epoxy molding compounds account for 80%-90% of the domestic market share, with mid-range products constituting the largest segment at 50%-60% market share [5] - The overall domestic production rate of epoxy molding compounds remains low, with only a few domestic manufacturers capable of R&D and production of mid-to-high-end products [5] - Domestic manufacturers are rapidly overcoming technological barriers set by Japanese firms through innovation and resource integration [5]