盛美上海：已推出多款适配HBM工艺设备

Group 1 - The core viewpoint of the article is that Shengmei Shanghai has launched multiple devices compatible with HBM (High Bandwidth Memory) technology [1] - The Ultra ECP 3D device from the company is specifically designed for TSV (Through-Silicon Via) copper filling [1] - The entire line of wet cleaning equipment and copper plating devices can be utilized for HBM processes [1] Group 2 - All packaging and testing equipment, including wet processing, coating, developing, and copper plating devices, are applicable for high-performance chip 2.5D packaging processes [1]