产融聚合、龙头赋能 威孚高科发行无锡首单专项用于“465”现代产业集群债券
WFHTWFHT(SZ:000581) Cai Jing Wang·2025-12-08 09:48

Group 1 - Wuxi Weifu High Technology Group Co., Ltd. successfully issued its first bond in the Shenzhen Stock Exchange, with a total scale of 500 million yuan and a term of 3 years at a coupon rate of 1.90%, marking the lowest historical rate for medium to long-term corporate bonds in Wuxi [1] - The bond was well-received with a subscription multiple of 2.99, indicating strong market confidence in the company's credit quality, operational strength, and growth prospects [1] - This bond issuance is a practical example of financial services supporting national strategies and promoting industrial upgrades, aligning with the central economic work conference's emphasis on technological innovation [4] Group 2 - The funds raised from this bond will primarily support technological innovation in the automotive parts sector, showcasing the company's commitment to national interests and innovative financial tools [4] - The bond aims to inject critical capital into the core automotive parts industry cluster, facilitating technological collaboration and overall industry upgrade, thereby supporting Wuxi's goal of becoming a nationally influential hub for industrial technological innovation [4] - The company plans to continue focusing on the development needs of the "465" modern industrial cluster, leveraging its resources and capital platform to enhance the resilience and competitiveness of the modern industrial system in Wuxi [4]