盛美上海：公司已推出多款适配HBM工艺的设备

Group 1 - The core viewpoint of the article is that Shengmei Shanghai has launched multiple devices compatible with HBM (High Bandwidth Memory) technology, indicating a focus on advanced packaging solutions for high-performance chips [2] - Shengmei Shanghai's UltraECP3d device is specifically designed for TSV (Through-Silicon Via) copper filling, showcasing the company's commitment to innovative manufacturing processes [2] - The company offers a full line of wet cleaning and copper plating equipment that can be utilized in HBM processes, as well as packaging equipment suitable for high-performance 2.5D chip packaging [2] Group 2 - The company emphasizes its adherence to information disclosure regulations, stating that it will promptly disclose relevant business information and order status if they meet the disclosure standards [2]