常熟银行(601128.SH):5亿元2025年科技创新债券发行完毕

Core Viewpoint - Changshu Bank has successfully issued a 5-year fixed-rate technology innovation bond with a total scale of RMB 500 million, aimed at supporting technology innovation businesses [1] Group 1: Bond Issuance Details - The bond was approved by the People's Bank of China and was recorded on December 4, 2025, with issuance completed on December 8, 2025 [1] - The coupon rate for the bond is set at 1.90% [1] Group 2: Purpose and Impact - The funds raised from this bond issuance will be used to specifically support businesses in the technology innovation sector, subject to applicable laws and regulatory approvals [1] - The successful issuance of the technology innovation bond expands the financing channels for supporting technology innovation enterprises and helps reduce their financing costs [1] - This initiative is expected to further enhance the bank's development in technology innovation business [1]