常熟银行：成功发行5亿元科技创新债券

Core Viewpoint - Changshu Bank has successfully issued 2025 technology innovation bonds, approved by the People's Bank of China, to support the financing of technology innovation enterprises [1][2]. Summary by Relevant Sections Bond Issuance Details - The bond was recorded on December 4, 2025, and fully issued on December 8, 2025, with a total issuance size of RMB 500 million [1][2]. - It is a 5-year fixed-rate bond with a coupon rate of 1.90% [1][2]. Purpose and Impact - The funds raised from this bond will be used to specifically support businesses in the technology innovation sector, in accordance with applicable laws and regulatory approvals [1][2]. - The successful issuance of these bonds will effectively broaden the financing channels for Changshu Bank to support technology innovation enterprises, helping to reduce their financing costs and further enhance the bank's development in technology innovation business [1][2].