芯源新材料完成C轮融资，北京小米智造独家投资

Core Viewpoint - Shenzhen Xinyuan New Materials Co., Ltd. has completed a Series C financing round, exclusively funded by Beijing Xiaomi Zhizao Investment Fund Partnership, focusing on the R&D and industrialization of silicon carbide module packaging materials [1] Group 1: Company Overview - Shenzhen Xinyuan New Materials was established in 2022 and specializes in the R&D, production, sales, and technical services of semiconductor packaging materials [1] - The company provides high thermal conductivity and high reliability solutions, including sintered silver materials, semi-sintered conductive adhesives, nano solder bonding materials, and electromagnetic shielding materials [1] - Its products are applied in various fields such as new energy vehicles, RF communication, smart grids, wind power, photovoltaics, and optoelectronics [1] Group 2: Leadership and Expertise - The CEO, Dr. Hu Bo, graduated from Harbin Institute of Technology and has over 15 years of experience in material research, particularly in sintered silver and conductive adhesives [3] - The R&D department consists of over ten PhD and master's degree holders, along with several laboratory technicians [3] Group 3: Product Development and Market Position - Shenzhen Xinyuan New Materials has successfully developed a series of products, including automotive-grade sintered silver products, communication-grade sintered silver products, optoelectronic packaging thermal silver adhesives, and thermal interface materials for integrated circuits [3] - The company is the only one in China to achieve mass production of automotive-grade sintered materials, with its product matrix deeply embedded in major automotive manufacturers, achieving a daily product installation volume exceeding 5,000 vehicles [3]