华海清科：12英寸减薄抛光一体机出机量突破20台

Core Insights - The company has achieved a significant milestone with the Versatile-GP300, surpassing 20 units produced, indicating strong market recognition and the successful application of domestic high-end semiconductor equipment in critical processes like 3D IC and advanced packaging [1][2] Group 1: Product Development and Innovation - The Versatile-GP300 integrates grinding thinning, chemical mechanical polishing (CMP), and cleaning modules, showcasing comprehensive breakthroughs in equipment structure, control systems, and process integration [1] - Since the first unit was delivered in 2021, the company has successfully transitioned from initial production to mass delivery, reflecting its commitment to independent innovation and overcoming key technological challenges [1] Group 2: Market Recognition and Performance - The product has received multiple awards, including the Good Design Gold Award, highlighting its industry value and contribution [2] - The Versatile-GP300 has secured repeat orders from several leading enterprises, with over 200,000 wafers shipped, demonstrating its performance and reliability in client production lines [2] Group 3: Future Strategy and Commitment - The company plans to leverage this milestone as a new starting point to deepen its "equipment + service" platform development strategy, expanding its diverse product matrix in high-end semiconductor equipment and services [2] - The company is committed to increasing R&D investment and providing advanced high-end equipment and complete process solutions to empower industry upgrades and ensure the safety and high-quality development of the supply chain [2]