帝尔激光(300776.SZ)：超快激光钻孔设备样机正在试制中

Core Viewpoint - The company, Dier Laser (300776.SZ), is focusing on its main business while actively expanding into consumer electronics, new displays, and integrated circuits sectors [1] Group 1: Business Focus and Expansion - The company has completed the shipment of panel-level glass substrate through-hole equipment for TGV devices, achieving comprehensive coverage of wafer-level and panel-level TGV packaging laser technology [1] - The company is currently developing ultrafast laser drilling technology for the PCB industry, with prototype equipment under trial production [1] Group 2: Order Sources and Technology Development - Major orders this year have come from XBC and TOPCon laser technologies, with additional orders in non-photovoltaic sectors for TGV laser micro-hole equipment pilot lines [1]