Sou Hu Cai Jing·2025-12-11 08:38Core Insights - TSMC's advanced packaging capacity is fully booked, with NVIDIA accounting for over half of the orders, indicating strong demand for semiconductor manufacturing [1] - NVIDIA has reserved 800,000 to 850,000 wafers for 2026, significantly outpacing competitors like Broadcom and AMD [1][3] Group 1: NVIDIA's Capacity Reservation - NVIDIA's large-scale capacity reservation is primarily to meet the growing production demands for the Blackwell Ultra chip and to prepare for the next-generation Rubin architecture [3] - Current orders do not include potential demand from the Chinese market for the H200 AI chip, suggesting that NVIDIA's capacity needs may increase further [3] Group 2: TSMC's Response to Demand - TSMC is actively expanding its advanced packaging facilities, planning to build eight wafer fabs at the AP7 plant and introducing two new packaging factories in Arizona, expected to start mass production in 2028 [3] - Due to limited capacity, TSMC has decided to outsource some processes of its CoWoS advanced packaging to companies like ASE and SPIL in Taiwan [3] Group 3: Industry Alternatives and Technology - The outsourcing decision has prompted some companies to consider alternative solutions, with Intel's EMIB technology gaining attention as a viable option [3] - EMIB offers advantages in area and cost, allowing for highly customized packaging layouts, but for GPU suppliers like NVIDIA and AMD, TSMC's CoWoS remains the preferred solution due to its bandwidth, transmission speed, and low latency requirements [3]