康达新材：中科华微已形成微控制器芯片、通用集成电路等四大产品管线

Core Viewpoint - Kangda New Materials has confirmed that Zhongke Huami has developed four major product lines in microcontroller chips (MCU), general integrated circuits, high power density power supplies, and system-in-package (SiP) circuits, indicating a strong position in specialized equipment sectors, particularly in the domestic replacement market for MCU [1] Group 1: Product Lines - The four major product lines include microcontroller chips (32-bit and 16-bit), system-level SiP chips (RF integrated control SiP chips, data processing modules, heterogeneous processor SiP chips), various analog integrated circuits (memory, power management, interface circuits, signal chain circuits), and high power density power supplies [1] Group 2: Market Application - The primary applications of these products are in specialized equipment, with a notable technological advantage and market influence in the domestic MCU replacement segment [1]