Red Avenue New Materials(SH:603650) Ge Long Hui·2025-12-12 09:07Core Viewpoint - Tongcheng New Materials (603650.SH) has successfully completed the production line construction and product validation for its CMP polishing pad project, which is set to enter the commercialization phase in 2025 [1] Group 1: Project Development - The CMP polishing pad project was initiated in May 2024 and has progressed smoothly [1] - The company is set to begin product validation with leading domestic chip enterprises in the first half of 2025 [1] - The company has already secured formal polishing pad orders from several important customers for both 8-inch and 12-inch wafers [1] Group 2: Commercialization - With the realization of mass production and shipment, the CMP polishing pad project is officially entering the commercialization stage [1]