USC(SH:688403) Xin Lang Cai Jing·2025-12-15 08:08Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is strategically positioning itself in the semiconductor industry by acquiring a significant stake in Xin Feng Technology and focusing on advanced packaging technologies to meet the growing demand for storage chips in the AI infrastructure era [2][3]. Company Overview - Hefei Xinhui Microelectronics Co., Ltd. was established on December 18, 2015, and went public on August 18, 2022. The company specializes in integrated circuit advanced packaging and testing services, with its main revenue source being display driver chip packaging and testing, accounting for 90.25% of total revenue [7]. - The company has been recognized as a "specialized, refined, distinctive, and innovative" small giant enterprise, which is a prestigious title in China for small and medium-sized enterprises that excel in niche markets and possess strong innovation capabilities [5]. Financial Performance - For the period from January to September 2025, the company achieved a revenue of 1.295 billion yuan, representing a year-on-year growth of 21.05%, and a net profit attributable to shareholders of 124 million yuan, up 23.21% year-on-year [8]. - As of September 30, 2024, the company's overseas revenue accounted for 54.15%, benefiting from the depreciation of the Chinese yuan [5]. Market Activity - On December 15, the company's stock price increased by 6.56%, with a trading volume of 1.299 billion yuan and a turnover rate of 8.94%, bringing the total market capitalization to 14.628 billion yuan [1]. - The company has seen a net inflow of 18.7396 million yuan from major investors, indicating a growing interest in the stock [4][5]. Technological Development - The company is focusing on advanced packaging technologies, including Chiplet technology, which encompasses various high-end packaging techniques such as bump manufacturing, Fan-out, 3D, and System in Package (SiP) [2][3].