兴森科技：公司坚定加码数字化转型和高端封装基板战略

Group 1 - The core viewpoint of the article is that the company, Xingsen Technology, is focusing on digital transformation and high-end packaging substrate strategies, particularly in the FCBGA packaging substrate market [1] - The company identifies chip design firms and packaging manufacturers as target customers for its packaging substrate business, although specific customer collaborations cannot be disclosed due to confidentiality agreements [1] - The company is accelerating the market expansion of its FCBGA packaging substrate project to enhance its core competitiveness [1]