兴森科技：公司PCB、半导体测试板、IC封装基板业务均正常经营

Core Viewpoint - The company, Xingsen Technology, confirmed that its PCB, semiconductor test boards, and IC packaging substrate businesses are operating normally, with readiness for mass production in the FCBGA packaging substrate segment depending on industry demand recovery and client progress [2] Group 1 - The company is actively engaged in the production of PCB, semiconductor test boards, and IC packaging substrates [2] - The FCBGA packaging substrate business has achieved sufficient production capacity and product yield for mass production [2] - The timeline for large-scale mass production is primarily influenced by the recovery of industry demand, the production progress of clients, and their supplier management strategies [2]