甬矽电子：公司坚定践行技术创新战略

Core Viewpoint - Yongxi Electronics is committed to a technology innovation strategy, focusing on advanced packaging through its proprietary Chiplet technology [2] Group 1: Company Strategy - The company has launched the FH-BSAP (Forehope-Brick-Style Advanced Package) modular advanced packaging technology platform [2] - The 2.5D product line includes various technical solutions such as RDL, silicon interposer, and silicon bridge, which are designed to meet diverse advanced packaging needs of customers [2]