江波龙年内筹划两轮融资：资金链承压，股东高管轮番套现，净利成色不足

Core Viewpoint - Jiangbolong (301803.SZ) is planning to raise up to 3.7 billion yuan through a private placement, focusing on memory products, main control chips, and high-end packaging and testing, amid concerns over the reasonableness of allocating nearly 1 billion yuan for R&D personnel salaries and the company's financial pressure reflected by two financing plans within a year [1][5][6]. Group 1: Financing Plans - Jiangbolong intends to raise 3.7 billion yuan through a private placement, with 880 million yuan allocated for AI-related high-end memory R&D, 1.22 billion yuan for semiconductor storage main control chip R&D, 500 million yuan for high-end packaging projects, and 1.1 billion yuan for liquidity support [2][4]. - This marks the second financing plan for the company in 2023, following a previous plan to list in Hong Kong aimed at expanding capacity and enhancing R&D [5]. Group 2: Financial Performance - Despite a recovery in the mobile and PC markets, Jiangbolong's revenue growth has significantly slowed compared to the previous year, with net profit growth primarily driven by non-recurring gains [1][9]. - In the first three quarters of 2025, the company achieved revenue of 16.734 billion yuan, a year-on-year increase of 26.12%, while net profit reached 713 million yuan, up 27.95% [9]. - The company's gross profit margin has declined, with a reported margin of 15.29% in the first three quarters of 2025, down 6.25 percentage points year-on-year [10]. Group 3: Inventory and Cash Flow Issues - Jiangbolong's inventory has been increasing significantly, with values of 3.744 billion yuan in 2022, 5.893 billion yuan in 2023, and 7.833 billion yuan in 2024, leading to negative cash flow from operating activities totaling over 4.3 billion yuan [11]. - As of September 30, 2025, inventory reached 8.517 billion yuan, accounting for 64.08% of current assets, while accounts receivable also increased to 2.76 billion yuan, up 68% year-on-year [11]. Group 4: Management and Shareholder Actions - Prior to the announcement of the financing plan, company executives and major shareholders engaged in significant share sell-offs, with the National Integrated Circuit Industry Investment Fund reducing its stake and cashing out approximately 4.72 billion yuan [7][8]. - Employee shareholding platforms also sold shares, realizing around 755 million yuan, coinciding with a period of stock price increases [8].