兴森科技：IC封装基板业务占比为21.09%，存储业务占IC封装基板的比例约2/3

Core Viewpoint - The company provided insights into its customer onboarding process and the business composition of its operations, highlighting the timelines for certification and the distribution of its business segments [1] Group 1: Customer Onboarding Process - The company indicated that the onboarding process for FCBGA packaging substrate customers involves technical rating, system certification, and product certification, with varying requirements based on customer specifications [1] - For major clients, the technical rating and system certification typically take about 6 months to complete, while the product certification also requires approximately 6 months [1] Group 2: Business Composition - As of the first half of 2025, the company's PCB business is expected to account for 71.45% of total operations, with applications depending on the end customers' product uses [1] - The IC packaging substrate business is projected to represent 21.09% of the total, with the storage segment making up about two-thirds of the IC packaging substrate business [1]