成功逆向ASML 中国首台EUV光刻机原型机组装

Core Viewpoint - A secret laboratory in China has assembled its first prototype of an EUV lithography system through reverse engineering of ASML's existing products, currently in testing and aiming for prototype chip production by 2028 [1][6]. Group 1: Prototype Development - The EUV lithography prototype was completed in early 2025 at a highly secure facility in Shenzhen, covering almost the entire factory [3][8]. - The prototype utilizes laser plasma (LPP) technology, similar to ASML's Twinscan NXE series, generating extreme ultraviolet light with a wavelength of 13.5 nanometers [5][8]. - The Chinese EUV lithography machine is significantly larger than ASML's comparable products but has demonstrated the capability to generate extreme ultraviolet light, although it has not yet produced usable chips [5][8]. Group 2: Team Composition - The development team for the Chinese EUV lithography system consists of former ASML engineers and recent university graduates, including employees from ASML's branches in China, the US, Europe, and Taiwan [5][8]. Group 3: Technical Challenges - A critical bottleneck remains as China has not been able to replicate ASML's high-precision optical systems, nor can it accurately project extreme ultraviolet light onto wafers, hindering the completion of lithographic imaging [6][8].