创业板第三套上市标准添新军!粤芯半导体IPO获受理

Group 1 - The core viewpoint of the news is that Yu Xin Semiconductor has submitted its IPO application to the Shenzhen Stock Exchange, aiming to raise 7.5 billion yuan, with Guangfa Securities as the sponsor [1] - Yu Xin Semiconductor is the first 12-inch wafer manufacturing enterprise in Guangdong Province to enter mass production, focusing on analog chip manufacturing, providing significant capacity support for the national integrated circuit industry strategy [1] - The company has become one of the leading wafer foundries for capacitive fingerprint recognition chips globally and is among the few domestic foundries capable of mass production of silicon-based CMOS ultrasonic fingerprint recognition chips [1] Group 2 - The company currently operates two 12-inch wafer fabs with a combined planned capacity of 80,000 wafers per month, achieving a capacity of 52,000 wafers per month as of the reporting period [1] - Future plans include the construction of an additional 12-inch integrated circuit line with a planned capacity of 40,000 wafers per month, which will increase the total planned capacity to 120,000 wafers per month [1] - Financial data shows that the company's operating revenues for 2022, 2023, 2024, and the first half of 2025 are 1.545 billion yuan, 1.044 billion yuan, 1.681 billion yuan, and 1.053 billion yuan respectively, with a 61.09% increase in 2024 compared to 2023 [1] Group 3 - Since its establishment, Yu Xin Semiconductor has maintained significant R&D investment, with R&D expenses accounting for a high proportion of operating revenue [2] - R&D expenditures during the reporting period were 601 million yuan, 605 million yuan, 446 million yuan, and 186 million yuan, representing 38.92%, 58%, 26.50%, and 17.62% of total revenue respectively [2] - As of June 30, 2025, the company has obtained 681 authorized patents (including overseas patents), of which 312 are invention patents [2]

Venture-创业板第三套上市标准添新军!粤芯半导体IPO获受理 - Reportify