金田股份：公司在芯片算力领域有较好的客户基础及技术储备

Group 1 - The core material for advanced AI industry chip interconnection and cooling facilities is copper, due to its excellent conductivity and thermal properties [2] - The transition of copper-based materials towards high added value is accelerating [2] - The company has a solid customer base and technical reserves in the chip computing power sector, with its high-precision non-oxygen copper busbar products applied in top-tier GPU cooling solutions globally [2] Group 2 - The company's self-developed copper heat pipes and liquid-cooled copper pipes are being supplied in bulk to several leading companies' computing server products [2] - The company will closely monitor and follow the market demand in the chip computing power field to further enhance its product lineup and competitive advantages [2]