芯源微：公司研发、技术与产品情况参见公司公告

Core Viewpoint - Chipone Microelectronics highlighted the essential differences and interconnections between temporary bonding and hybrid bonding technologies in the advanced packaging and integration field of semiconductors [2] Group 1 - Temporary bonding and hybrid bonding are two important technologies in semiconductor advanced packaging and integration [2] - These technologies differ fundamentally in their purposes, main processes, and final applications [2] - Despite their differences, they work closely together in modern advanced packaging [2]