交银上证科创板100指数A（023050）基金经理为邵文婷。 截至发稿，邵文婷累计任职时间4年212天，现任基金资产总规模135.61亿元，任职期间最佳基金回报 36.71%， 任职期间最差基金回报-35.14%。 11月26日，芯源微涨5.1%，截至发稿，报126.54元/股，成交3.48亿元，换手率1.39%，总市值255.14亿 元。 资料显示，沈阳芯源微电子设备股份有限公司位于辽宁省沈阳市浑南区彩云路1号，成立日期2002年12 月17日，上市日期2019年12月16日，公司主营业务涉及半导体专用设备的研发、生产和销售。主营业务 收入构成为：光刻工序涂胶显影设备59.86%，单片式湿法设备36.76%，其他(补充)2.51%，其它设备 0.86%。 从基金十大重仓股角度 数据显示，交银施罗德基金旗下1只基金重仓芯源微。交银上证科创板100指数A（023050）三季度减持 1.2万股，持有股数1.54万股，占基金净值比例为1.84%，位居第九大重仓股。根据测算，今日浮盈赚取 约9.44万元。 交银上证科创板100指数A（023050）成立日期2025年2月26日，最新规模6297.39万。成立以来收益 ...

（文/罗叶馨梅）11月24日，芯源微在2025年第三季度业绩说明会上，就前三季度经营情况和未来发展规划与投资者进行了交流。公司介绍，其专业从事半 导体专用设备的研发、生产和销售，总部位于沈阳浑南，并在日本、上海、广州等地设有子公司，已形成前道涂胶显影、前道清洗、后道先进封装及化合 物、核心零部件四大业务板块，累计出厂设备超过2000台套，被视为国内半导体设备细分领域龙头企业之一。 在产品布局方面，芯源微表示，公司目前主营产品包括前道涂胶显影设备、前道物理清洗设备、前道化学清洗设备以及后道先进封装和化合物等小尺寸设 备。其中，前道涂胶显影机、前道物理清洗机持续获得国内领先逻辑、存储等客户订单，前道化学清洗机已取得多家大客户正式订单及验证性订单。后道先 进封装用涂胶显影设备、单片式湿法设备，已连续多年作为主流机型批量应用于台积电、盛合晶微、长电科技、华天科技、通富微电、珠海天成等海内外一 线大厂，并持续获得海外封装龙头客户的重复性批量订单。 谈及前三季度经营业绩时，芯源微披露，公司实现营业收入9.9亿元，同比下降10%，归属于母公司股东的净利润为-1004.9万元。公司解释称，收入下滑主 要有三方面原因：一是前道 ...

芯源微在投资者互动平台回答称，2025年是公司研发的大年，包括新一代涂胶显影机、高端化学清洗 机、先进封装新产品、核心零部件等研发投入及人才储备强度较大。同时，公司战略新产品前道化学清 洗机订单快速增长，对应投入的管理费用、销售费用持续增加。但公司新产品从研发、获得订单到转化 成收入需要一定周期，会有投入产出时间上的错配。另外叠加政府补助未如期到账、汇兑损失等因素， 导致利润下滑。公司将继续锚定前道涂胶显影、前道清洗、后道先进封装三大核心主赛道，以客户为中 心，持续提升产品竞争力及市场占有率，不断做优做大经营体量。 ...

芯源微11月24日召开2025年第三季度业绩说明会，公司针对2025年第三季度的经营成果及财务指标的具 体情况与投资者进行交流。 芯源微专业从事半导体专用设备的研发、生产和销售，公司总部位于沈阳市浑南区，并在日本、上海、 广州等地设有子公司。公司已形成前道涂胶显影、前道清洗、后道先进封装及化合物、核心零部件四大 业务板块，产品累计出厂超过2000台套，是国内半导体设备细分领域龙头。 芯源微在本次业绩说明会上介绍，公司产品包括前道涂胶显影设备、前道物理清洗设备、前道化学清洗 设备、后道先进封装设备和化合物等小尺寸设备。公司前道涂胶显影机、前道物理清洗机持续获得国内 领先逻辑、存储等客户订单；前道化学清洗机获得国内多家大客户订单及验证性订单；后道先进封装用 涂胶显影设备、单片式湿法设备已连续多年作为主流机型批量应用于台积电、盛合晶微、长电科技 （600584）、华天科技（002185）、通富微电（002156）、珠海天成等海内外一线大厂，持续获得海外 封装龙头客户批量重复性订单。 在谈及经营业绩情况时，芯源微表示，公司前三季度实现营业收入9.9亿元，同比下降10%，主要原因 一是前道Track产品成熟性还不高，客 ...

Core Viewpoint - The stock of ChipSource Microelectronics has experienced fluctuations, with a recent decline of 2.00% and a year-to-date increase of 51.33%, indicating volatility in the semiconductor equipment sector [1][2]. Financial Performance - For the period from January to September 2025, ChipSource reported a revenue of 990 million yuan, a year-on-year decrease of 10.35%, and a net profit attributable to shareholders of -10.05 million yuan, a significant decline of 109.34% [2]. - Cumulative cash dividends since the company's A-share listing amount to 139 million yuan, with 86.89 million yuan distributed over the past three years [3]. Shareholder Structure - As of September 30, 2025, the number of shareholders increased by 15.37% to 16,000, while the average circulating shares per person decreased by 13.17% to 12,633 shares [2]. - The top ten circulating shareholders include notable funds such as Nuoan Growth Mixed A and Jiashi Shanghai Stock Exchange Science and Technology Innovation Board Chip ETF, with some funds reducing their holdings significantly [3]. Market Activity - As of November 20, 2025, ChipSource's stock price was 126.39 yuan per share, with a trading volume of 238 million yuan and a turnover rate of 0.92% [1]. - The stock has seen a net outflow of 17.95 million yuan from major funds, indicating a cautious sentiment among institutional investors [1]. Business Overview - ChipSource Microelectronics, established on December 17, 2002, specializes in the research, production, and sales of semiconductor equipment, with a significant revenue contribution from photolithography equipment [1]. - The company operates within the semiconductor equipment sector and is associated with advanced packaging, photoresist, and major players like Huawei and SMIC [1].

Core Viewpoint - The photoresist sector has experienced a short-term surge, with Huarong Chemical rising over 10%, and other companies such as Yake Technology, ChipSource Micro, New Lai Materials, Jiaxian Co., and Jingrui Electric Materials also seeing increases [1] Group 1 - Huarong Chemical's stock price increased by more than 10% [1] - Other companies in the photoresist sector, including Yake Technology, ChipSource Micro, New Lai Materials, Jiaxian Co., and Jingrui Electric Materials, also experienced stock price increases [1]

Core Viewpoint - The stock of ChipSource Micro has shown a significant increase in price and trading activity, indicating positive market sentiment despite a decline in revenue and net profit for the year [1][2]. Group 1: Stock Performance - As of November 19, ChipSource Micro's stock price rose by 2.18% to 129.90 CNY per share, with a trading volume of 69.8 million CNY and a turnover rate of 0.27% [1]. - Year-to-date, the stock price has increased by 55.53%, with a 2.41% rise over the last five trading days, 3.79% over the last 20 days, and 6.48% over the last 60 days [2]. Group 2: Company Overview - ChipSource Micro, established on December 17, 2002, and listed on December 16, 2019, is located in Shenyang, Liaoning Province, and specializes in the research, production, and sales of semiconductor equipment [2]. - The company's main revenue sources include photoresist coating and developing equipment (59.86%), single-wafer wet processing equipment (36.76%), and other equipment (2.51% and 0.86%) [2]. Group 3: Financial Performance - For the period from January to September 2025, ChipSource Micro reported a revenue of 990 million CNY, a year-on-year decrease of 10.35%, and a net profit attributable to shareholders of -10.05 million CNY, a decline of 109.34% [2]. - The company has distributed a total of 139 million CNY in dividends since its A-share listing, with 86.9 million CNY distributed over the past three years [3]. Group 4: Shareholder Structure - As of September 30, 2025, the number of shareholders increased by 15.37% to 16,000, with an average of 12,633 shares held per shareholder, a decrease of 13.17% [2]. - Notable changes in institutional holdings include a decrease in shares held by major funds such as Nuoan Growth Mixed A and Jiashi Shanghai Stock Exchange Science and Technology Innovation Board Chip ETF, while new shareholders like Yongying Semiconductor Industry Select Mixed Fund entered the top ten [3].

Group 1 - The core point of the news is the significant stock price movements in the photoresist sector, with companies like Tongyi Co., Ltd. and Kemet Gas reaching their daily limit up [1] - Tongyi Co., Ltd. (300538) saw a price increase of 19.99%, closing at 20.71, while Kemet Gas (002549) increased by 10.00%, closing at 23.31 [2][3] - Other companies in the sector, such as Northern Huachuang and New Lai Materials, also experienced notable gains, with Northern Huachuang rising by 7.69% to 431.50 and New Lai Materials increasing by 5.97% to 55.18 [2][3] Group 2 - The stock price of N Hengkong surged by 294.93%, indicating a strong market interest in the photoresist sector [2] - The overall market performance for the photoresist sector was positive, with multiple companies showing significant percentage increases in their stock prices [1][2] - The trading volume and market dynamics suggest a robust investor sentiment towards companies involved in the photoresist industry [1][2]

Group 1 - The semiconductor sector is experiencing a strong rebound, with notable stock increases for companies such as Northern Huachuang (+7%) and Chipone (+6%), contributing to a 3.19% rise in the Sci-Tech Semiconductor ETF and a 2.21% increase in the Chip ETF [1] - Samsung has raised the prices of some memory chips by 30%-60% month-on-month, indicating a supply gap in the storage industry, which is expected to persist at high price levels [2] - Yangtze Memory Technologies is constructing a third factory in Wuhan, expected to be operational by 2027, while also increasing the capacity of its second factory [2] Group 2 - SK Hynix is accelerating its equipment investment, with plans to order equipment for 12-layer HBM4 by November 2025, with installations expected to begin in early 2026 [2] - Huajin Securities is optimistic about the semiconductor cycle driven by artificial intelligence, recommending attention to the entire semiconductor industry chain from design to manufacturing and packaging testing [2] - The Sci-Tech Semiconductor ETF (588170) focuses on domestic semiconductor replacement equipment and materials, with a 3.19% increase, including key stocks like Zhongwei Company and Tuo Jing Technology [3]

Group 1 - The article emphasizes that the advanced packaging equipment industry is entering a golden era driven by the AI wave and domestic substitution, with significant growth opportunities arising from the demand for advanced packaging technologies [1][8]. - The global advanced packaging market is projected to grow from $46 billion in 2024 to $79.4 billion by 2030, with a compound annual growth rate (CAGR) of 37% for 2.5D/3D packaging technologies from 2023 to 2029 [7][8]. - The Chinese semiconductor packaging equipment market is expected to reach a sales revenue of 28.27 billion yuan in 2024, reflecting an 18.93% year-on-year growth [12]. Group 2 - The article discusses the rapid development of domestic semiconductor packaging equipment manufacturers in China, such as North Huachuang and Shengmei Shanghai, amidst a competitive landscape dominated by international giants [8][9]. - The demand for advanced packaging technologies is driven by the need for high-density integration and improved chip performance, particularly in AI models, data centers, and high-end consumer electronics [7][8]. - The article highlights the evolution of bonding technologies, with a significant shift towards advanced techniques that enhance integration density and performance, such as hybrid bonding and laser debonding [13][16]. Group 3 - The article outlines the critical role of various semiconductor equipment types, including thinning machines, dicing machines, and die bonders, in the advanced packaging process, emphasizing the need for precision and efficiency [27][28]. - It notes that the laser cutting technology is gaining traction due to its advantages in energy efficiency and adaptability to complex packaging requirements, with the global wafer cutting equipment market expected to grow significantly [26]. - The article also mentions the importance of surface functionalization technologies in enhancing the performance of advanced packaging, particularly in applications like chip-on-wafer and fan-out packaging [35][39].