Core Viewpoint - Huahai Qingshi announced that its CMP equipment has exceeded 800 units in total, marking a significant achievement in the domestic integrated circuit manufacturing sector and enhancing its position as a leading domestic supplier in CMP equipment [1][3] Group 1: Product Development and Market Position - The company's CMP equipment covers major product lines including logic, 3D NAND storage, and DRAM storage, and has successfully entered supply chains for large silicon wafers, third-generation semiconductors, CIS, MEMS, MicroLED, and advanced packaging [1] - The recognition of the company's technology, product maturity, quality reliability, and market adaptability has been highly acknowledged within the industry, reinforcing its leading position in the CMP equipment sector [1] Group 2: Strategic Initiatives and Future Outlook - The domestic AI technology advancements in algorithm architecture and computing power density are creating significant opportunities for the development of advanced packaging and chip stacking technologies [3] - The synergy between CMP equipment and other products such as thinning, cutting, and edge grinding equipment will provide comprehensive solutions for advanced packaging and chip stacking, broadening future application scenarios and market growth potential [3] - The increasing inventory of CMP equipment will enhance the company's "equipment + service" platform strategy, leading to rapid growth in key consumables and maintenance service business, contributing to stable profit growth [3] - The company will continue to focus on independent innovation in core technologies and increase R&D investment, targeting breakthroughs in advanced processes and continuously upgrading product performance [3] - The company aims to track trends in advanced packaging technologies like HBM and CoWos, promoting product innovation and category expansion to seize opportunities in the integrated circuit industry chain [3]
华海清科CMP装备累计出机突破800台