Hwatsing Technology (SH:688120) Ju Chao Zi Xun·2025-12-21 02:13Core Insights - The company has achieved a significant milestone with over 800 units of Chemical Mechanical Polishing (CMP) equipment delivered, indicating enhanced technical strength, product competitiveness, and market recognition in the CMP sector [2] Group 1: Product and Market Development - The delivered CMP equipment includes key models such as Universal-H300 and Universal-S300, covering a wide range of applications in mainstream product lines like logic, 3D NAND storage, and DRAM storage [2] - The company has successfully penetrated supply chains of leading customers in advanced fields such as large silicon wafers, third-generation semiconductors, CIS, MEMS, MicroLED, and advanced packaging, achieving full coverage and mass application in domestic integrated circuit manufacturing lines [2] Group 2: Future Growth and Strategy - The rise in domestic AI technology is driving opportunities in advanced packaging and chip stacking, with the company's CMP equipment expected to synergize with thinning, cutting, and edge polishing equipment to provide comprehensive solutions [3] - The increasing number of CMP equipment units will enhance the company's "equipment + service" platform strategy, leading to rapid growth in key consumables and maintenance service business, contributing to stable profit growth [3] - The company plans to continue focusing on independent innovation in core technologies and increase R&D investment, targeting advancements in process technology and product performance while tracking trends in advanced packaging technologies like HBM and CoWos [3]