华海清科CMP装备累计出机超800台， 平台化战略协同效应显著释放

Core Insights - The company has successfully delivered over 800 CMP equipment units, covering major product lines such as logic, 3D NAND storage, and DRAM storage, while also entering advanced sectors like large silicon wafers and third-generation semiconductors [1] - The recognition of the company's technology, product maturity, and market adaptability has strengthened its position as a leading domestic CMP equipment provider [1] Group 1 - The company's CMP equipment has achieved full coverage and mass application in domestic mainstream integrated circuit manufacturing lines, enhancing its market recognition and industry influence [1] - The company believes that breakthroughs in domestic AI technology will drive opportunities in advanced packaging and chip stacking technologies, expanding the market growth potential [2] - The synergy between CMP equipment and other products like thinning, cutting, and edge grinding equipment will provide comprehensive solutions for advanced packaging and chip stacking [2] Group 2 - The company plans to continue focusing on independent innovation and increasing R&D investment, targeting advancements in process technology and product performance [2] - The company reported a revenue of 3.194 billion yuan for the first three quarters of 2025, a year-on-year increase of 30.28%, and a net profit of 791 million yuan, up 9.81% year-on-year [3] - New product breakthroughs are expected by Q3 2025, including the first 12-inch low-temperature ion implanter and the mass shipment of 12-inch wafer edge trimming equipment [3]