Zhi Tong Cai Jing·2025-12-22 03:31Core Viewpoint - ASMPT's stock rose over 4% following a significant order from SK Hynix for new thermal compression bonding machines to support HBM4 production, indicating strong demand for advanced semiconductor manufacturing equipment [1] Group 1: Company Developments - SK Hynix has placed an order for a batch of new thermal compression bonding machines (TCB) from ASMPT to enhance HBM4 production [1] - Last month, SK Hynix ordered seven TCB systems from ASMPT, each equipped with two bonding heads, with a unit price of approximately 4 billion KRW, leading to a total contract value of around 30 billion KRW (approximately 150 million RMB) [1] - SK Hynix plans to order an additional 100 TCB machines for HBM4 by March 2026 to support the expansion of its Cheongju M15X wafer fab [1] Group 2: Industry Context - The decision by SK Hynix to source equipment from ASMPT is influenced by ongoing patent disputes between local suppliers Hanmi Semiconductor and Hanwha Semiconductor, which have led to internal conflicts [1] - If the Korean manufacturers do not resolve their patent issues promptly, ASMPT may further increase its market share and potentially dominate the supply of HBM4 equipment [1]