龙迅股份递交H股上市申请，募资加码研发与全球布局

Core Viewpoint - Longxin Co., Ltd. has submitted an application for the public offering of H-shares and listing on the Hong Kong Stock Exchange, aiming to enhance its market presence and capitalize on growth opportunities in the semiconductor industry [2]. Group 1: Company Overview - Longxin Co., Ltd. is a leading designer of high-speed mixed-signal chips, focusing on creating efficient and reliable "data highways" for smart terminals, devices, and AI applications [2]. - The company's core competencies are concentrated in three main areas: high-bandwidth serializers/deserializers (SerDes), high-speed interface protocol processing and data encryption, and high-definition audio/video processing and display driver technology [2]. - Longxin's products enable seamless data transmission and processing, facilitating efficient interaction between computing, storage, and display units, with applications in smart visual terminals, automotive systems, AR/VR devices, and high-performance computing (HPC) [2]. Group 2: Market Position - According to Frost & Sullivan, Longxin ranks first in the video bridge chip market in mainland China and is among the top five fabless design companies globally, with video bridge chips being a crucial component of mixed-signal chips [3]. - The company's deep-rooted technological foundations, developed over nearly two decades, support seamless, high-speed, and stable transmission of high-definition audio and video data across various applications, including robotics, drones, AR/VR devices, and autonomous driving systems [3]. Group 3: Fundraising Purpose - The funds raised from the H-share issuance will be allocated to five key areas: enhancing R&D and innovation capabilities, expanding the product matrix and downstream application scenarios, increasing overseas business networks, pursuing strategic investments and acquisitions in the global semiconductor industry, and serving as working capital for general corporate purposes [4]. - The company aims to maintain high levels of R&D investment to continuously optimize product performance and strengthen its international market share through collaborations with global chip manufacturers and the establishment of a dual-track supply system [4].