美光科技取得定位微电子装置接合垫技术专利

Core Viewpoint - Micron Technology has been granted a patent for a technology related to "bond pads for positioning microelectronic devices and associated microelectronic devices, methods, and systems" with the announcement number CN116314094B, which was applied for on December 2022 [1] Group 1 - The patent signifies a potential advancement in microelectronics technology for Micron Technology [1] - The application date of the patent indicates ongoing innovation efforts by the company in the microelectronics sector [1]