桐昆集团股份有限公司关于2025年度第五期科技创新债券到期兑付的公告

Core Viewpoint - Tongkun Group Co., Ltd. successfully redeemed its fifth phase of technology innovation bonds, indicating strong financial management and commitment to fulfilling debt obligations [1] Group 1: Bond Issuance Details - The company issued the fifth phase of technology innovation bonds on June 20, 2025, with a total amount of 500 million RMB [1] - The bonds have a maturity period of 183 days and an interest rate of 1.79% [1] - The total amount of funds raised was fully received by June 23, 2025 [1] Group 2: Redemption Information - The bonds matured on December 23, 2025, and the company completed the repayment of both principal and interest [1] - The total amount paid for the redemption was 504,487,260.27 RMB [1]