超声电子拟10亿扩充高端产能 获专利授权653项技术国内领先

Core Viewpoint - The company, Ultrasonic Electronics, is accelerating its expansion efforts by investing approximately 1.008 billion yuan in a high-performance HDI printed circuit board (PCB) production capacity upgrade project, aiming to enhance its competitiveness in the AI-driven mobile terminal and automotive electronics markets [2][3][4]. Group 1: Expansion Plans - The project will involve upgrading existing facilities and purchasing advanced production and testing equipment, with an expected annual production capacity increase of 240,000 square meters of high-performance HDI PCBs [3]. - The project is expected to reach 50% of its designed capacity by December 2026, and 100% by June 2027, with monthly production targets of 10,000 square meters and 20,000 square meters, respectively [3]. Group 2: Financial Performance - For the first three quarters of 2025, the company reported revenues of 4.674 billion yuan and a net profit attributable to shareholders of 178 million yuan, reflecting year-on-year growth of 10.91% and 20.93%, respectively [2][7]. - The company anticipates that the new project will generate an additional annual revenue of 808 million yuan and a profit of 112 million yuan once fully operational [4]. Group 3: Research and Development - Ultrasonic Electronics has consistently invested over 200 million yuan in R&D annually for five consecutive years, totaling 1.325 billion yuan over the past five years [6][7]. - As of mid-2025, the company has been granted 653 patents, including 185 invention patents, and has been recognized as a national-level innovative enterprise [6][7]. Group 4: Industry Context - The PCB industry in China is projected to maintain a 52.7% share of the global market by 2029, indicating significant growth potential for domestic manufacturers [4]. - The company's product lines are well-positioned to benefit from the increasing demand driven by AI technology across various sectors, particularly in smart terminals and automotive electronics [5].