德龙激光(688170.SH)：有光模块生产设备相关业务

Core Viewpoint - Delong Laser (688170.SH) has developed a patented "silicon photonic chip laser bonding equipment" aimed at addressing issues in optical communication module production, utilizing laser as a heat source instead of traditional reflow soldering methods [1] Group 1: Technology and Innovation - The patented technology solves the problem of uneven heat distribution during chip bonding, which can lead to variations in metallurgical bonding forms [1] - The innovation represents a significant advancement in the production process for optical modules [1] Group 2: Business Operations - Delong Laser has secured orders from several leading domestic clients for its optical module production equipment [1] - Despite the acquisition of these orders, the revenue contribution from this business segment remains relatively small within the company's overall income [1]